What are the latest developments in the fields of science, technology, and engineering? What are some possible solutions to common challenges? How do you share your research with an engaged community of peers? The 6th International Conference on Modern Approaches in Science, Technology & Engineering is the answer to all of these questions. Researchers, academics, scholars, and others will come together for 3 days of intense learning and networking. Join us on the 07-09 of May 2020 in the city of Milan. Whether you want to present your latest research, learn from fellow academics, or soak in the dynamic vibe of the international community, STECONF is a must-attend event of the year.
On top of that, you’ll get to spend a beautiful day exploring Milan and its rich culture, architecture, and cuisine as all participants are invited to join a free tour of the city.
In the history of the STECONF series, the conferences have been held in 5 different countries. The previous series of STECONF was held in Germany (Berlin), Italy (Rome), Sweden (Stockholm), France (Paris) and Spain (Madrid). With the overwhelming support and acknowledgement from all the delegates of STECONF, we wish to pioneer a way to another outstanding event.
The conference is seeking submissions related to the following conference topics:
Engineering and Technology, Physical and life sciences, and Health and Medicine .Other related topics will also be considered.
Milan, the motivating force behind the financial sector of Italy, is the second largest city in the country behind Rome. The city holds a strong position as the capital of the Province of Milan as well as the regional capital of the Region of Lombardy. While Rome does enjoy its position as the administrative capital of Italy, Milan makes it presence felt strongly in many areas mainly in the fashion industry. Along with the powerful names of Paris, New York and London, Milan is referred as one of the fashion capitals of the world. The heart of the financial hub of Italy lies in Milan with the National Stock Exchange located in the city. The urban look of the city may not exactly make heads turn as it does with other Italian cities that have long Roman history emotionally involved with them. Nevertheless, the fashion expositions, nightlife, Italian food and the metropolitan area of Milan provide the futuristic outlook of Italy, which attracts many youngsters. Also, it’s like a base camp for exploring Northern Italy’s tourist cities which include the Alps.
FONDAZIONE COLLEGIO DELLE UNIVERSITÀ MILANESI
Address: Via S. Vigilio, 10, 20142 Milano MI, It
international conference 2020
Collaborate, Share your knowledge, Expand your network and Make a difference through (STECONF) academic conference
This academic conference cover all topics are related engineering conferences
international conference 2020, academic conference, engineering conferences, multidisciplinary conference
Teams of 3+ participants receive a 10% discount on the delegate passes. Contact us to claim your discount.
for more information, please CONTACT US.
Deadline: 24 April 2020
- Authors (Students): €230
- Authors (Regular): €260
- Listener: €120
- Virtual Delegate: €160
Deadline: 24 April 2020
Paper Publication Opportunity
academic conference Proceedings and Publication
The 6th International Conference on Modern Approaches in Science, Technology & Engineering offers a unique opportunity to get your work published and viewed by hundreds of thousands of peers, students, and other members of the academia around the world.
- All accepted research papers will be published and indexed in the conference proceedings.
- Each Paper will be assigned Digital Object Identifier (DOI) from Cross Ref.
- The proceedings shall be submitted to Google Scholar for Indexing.
- The Conference Proceedings will be published in the conference proceeding with an ISBN in a soft form.
- All papers have publication opportunity in ISI and Scopus indexed journals.
- All papers have publication opportunity in various indexed international journal.
- All accepted abstracts will be published in the conference abstract Proceedings ISBN 978-609-485-061-5. All full papers sent for conference proceedings will be accepted through a double blind review process and will be published electronically in proceedings with a DOI number.
A platform for idea and knowledge sharing
Focus on fresh outlook and perspective